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BACCINI LASER SAWS

Designed for squaring round monocrystalline wafers for solar cell manufacturing.Year of manufacture:...
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  • Product SKU: VA330
  • Product Name: BACCINI LASER SAWS
  • Manufacturer: -ASSORTED
  • Manufacturer Spec File: va330.pdf
Description:

Designed for squaring round monocrystalline wafers for solar cell manufacturing.
Year of manufacture: January 2006
Time in production: 20 hours
Technical specification:
throughput 1200 wafers/hr/saw
Mechanical yield 99.9%
Wafer size capability 150mm round to 125mm pseudo-square 200mm round to 155mm pseudo-square 300mm round to 208mm pseudo-square 165mm square to 156.5mm square cut tolerance 0.25mm cut squareness 0.5mm cut
Alignment center notch wafer thickness 400 to 1000 microns wafer scribe
Depth 1/3 of wafer thickness edge quality no chips greater than 0.5mm off-axis programmable from 0 to 20.
Click on MORE INFO to see photos in pdf format. Condition: Used Working

  • Product Availability: Available
SKU
VA330

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International:514-619-6981

Designed for squaring round monocrystalline wafers for solar cell manufacturing.
Year of manufacture: January 2006
Time in production: 20 hours
Technical specification:
throughput 1200 wafers/hr/saw
Mechanical yield 99.9%
Wafer size capability 150mm round to 125mm pseudo-square 200mm round to 155mm pseudo-square 300mm round to 208mm pseudo-square 165mm square to 156.5mm square cut tolerance 0.25mm cut squareness 0.5mm cut
Alignment center notch wafer thickness 400 to 1000 microns wafer scribe
Depth 1/3 of wafer thickness edge quality no chips greater than 0.5mm off-axis programmable from 0 to 20.
Click on MORE INFO to see photos in pdf format. Condition: Used Working
  • Product SKU: VA330
  • Product Name: BACCINI LASER SAWS
  • Manufacturer: -ASSORTED
  • Manufacturer Spec File: va330.pdf
Description:

Designed for squaring round monocrystalline wafers for solar cell manufacturing.
Year of manufacture: January 2006
Time in production: 20 hours
Technical specification:
throughput 1200 wafers/hr/saw
Mechanical yield 99.9%
Wafer size capability 150mm round to 125mm pseudo-square 200mm round to 155mm pseudo-square 300mm round to 208mm pseudo-square 165mm square to 156.5mm square cut tolerance 0.25mm cut squareness 0.5mm cut
Alignment center notch wafer thickness 400 to 1000 microns wafer scribe
Depth 1/3 of wafer thickness edge quality no chips greater than 0.5mm off-axis programmable from 0 to 20.
Click on MORE INFO to see photos in pdf format. Condition: Used Working

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